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    Complex Block: Post-Layout Simulation
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Complex-Block Characterization includes computationally intensive verification tasks from pre- and post-layout simulation to variation, noise, and RF analysis on circuits such as PLLs, DLLs, ADCs, SerDes, Tx chains, Rx chains, and memory interfaces.

In today’s complex blocks, designers disregard parasitics at their risk. During pre-layout simulation designers include the most critical parasitics only, i.e., those they expect to have first-order functional and performance effects. Designers run post-layout transient simulation to see second-order performance effects, as well as to verify their choices for critical first-order parasitics in the pre-layout simulation.

Post-layout netlists generally have on the order of 4x-10x more total elements than the equivalent pre-layout netlist, although the number can sometimes be much higher. Resistors and capacitors dominate the total count, but parasitics increasingly include inductance and even mutual inductance. Even though resistors and capacitors are simple components, the total element count often increases beyond 100K elements. In many cases traditional SPICE simulators simply cannot converge on such circuits. When traditional SPICE does converge, the runtimes can be 2x-4x or longer versus the circuit’s pre-layout simulation.

Digital fastSPICE simulators generally do not even have sufficient accuracy for pre-layout simulation. Even designers who use digital fastSPICE for pre-layout generally consider applying them post layout is a waste of time because their results will be misleading at best. This is often a moot point because of digital fastSPICE’s notoriously poor support of inductors.

Complex-Block Post-Layout Transient Examples

complexblock

The first circuit in the table above exemplifies the problems with traditional SPICE and digital fastSPICE for post-layout complex blocks. It is a 3rd-order sigma-delta ADC with ~14x more parasitics than transistors. SPICE did not converge (DNC), so the designer tried digital fastSPICE. After block-level tuning the designer got digital fastSPICE to complete a run in 333 hours – that’s about 1.5 weeks and 18x longer than the pre-layout SPICE run. Fortunately in this case the designer was evaluating the simulator on a circuit that was already in silicon. The digital fastSPICE SNR was off by 5 dB. Not surprisingly the designer deemed the accuracy unacceptable and decided not to use digital fastSPICE for such applications in the future. The designer tried Analog FastSPICE (AFS) on the exact same netlist and was astounded that the tool completed transient in just 29 hours with results within 1 dB of silicon.

The other examples also clearly demonstrate how AFS easily handles otherwise impractical or impossible problems. The DLL has over 200K total elements; AFS reduced the runtime from 1.8 days to 7.3 hours. Few design teams have 3.4 weeks to run the post-layout PLL, but most would be willing to spend the 3.2 day AFS runtime to check it. The next example is a second sigma-delta ADC in which AFS was 25x faster.

The last three circuits have especially high parasitic-to-transistor ratios. The video ADC is the post-layout version of the pre-layout video ADC in the Complex Block: Pre-layout simulation page. There were 842K total elements and 11.3K transistors in the post-layout netlist for a ~75x ratio. Traditional SPICE was able to converge and complete transient analysis in 8.6 days. AFS took only 16 hours. This 13x speedup is comparable to the 15x speedup pre-layout. The bias circuit had a 100x ratio, did not converge in SPICE, and finished in just 48 minutes using AFS. The last circuit, a VCO, included inductors and mutual inductors in addition to resistors and capacitors and had an overall parasitic-to-transistor ratio over 45x. The designer’s “golden” SPICE simulator took 22x longer than AFS to produce the same results.

Click here to continue to Complex Block: Variation Analysis.


 

 

 
           
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